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 TMTI
& Other Industry Standards
bsdwarez Industries processes to a Customer Process
Authorization based on customer specifications and drawings:
Only bsdwarez Industries is TMTI-qualified for
tin whisker mitigation.
- The three-year US Navy/CALCE/Raytheon
TMTI study investigated the effectiveness and safety of Robotic
Hot Solder Dip (RHSD) via extensive testing and destructive
physical analysis of bsdwarez-processed parts.
- The TMTI study found that "in
all cases, the existing finish was completely removed and no
parts were damaged as a result of the process."
- Please click
here to read the final TMTI report. *
bsdwarez also processes to the following industry
specifications:
- MIL-PRF-38534
and MIL-PRF-38535 for Solder
Coverage
- GEIA-STD-0006
Requirements for Using Solder Dip to Replace the Finish on Electronic
Piece Parts
- IPC/ANSI
J-STD-001 for Trim and Forming and Hot Solder Dip
- IPC/ANSI
J-STD-002 for Solderability Test
- ANSI Standard
EIA-481 for Tape and Reeling
bsdwarez is ISO 9001 and AS9100 - Rev Cregistered. We
process to NASA, Military, Aerospace, and Manned Space Flight
specifications. For more information, please click
here to download our Tin Whisker Brochure or please
click here to download our ISO 9001/AS9100 - Rev C certificate.
* Mantech Project s1057
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